Description |
Specification |
General - Inch (mm) |
Advanced - Inch (mm) |
| Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) / Polyimide |
| Max Layer Count |
40 Layers |
| Min Cu Foil Thickness |
1/3 oz (12) |
| Min Dielectric Thickness |
0.004" (0.1mm) |
| Via Hole Plugging |
 |
| Min Board Thickness (a) |
0.015"(0.4mm) |
 |
| Max Board Thickness (b) |
0.25"(6.4mm) |
| Board Thickness Tolerance (%) |
±10% ~ ±5% |
| Layer to Layer Registration |
±0.005" (±0.127mm ) |
±0.004" (±0.1mm) |
| Impedance Control (+/- %) |
±10% |
| Max Warpage |
0.008" (0.2mm) |
0.006" (0.15mm) |
Images |
| Min Trace Width (a) |
0.006"(0.15mm) |
 |
0.004"(0.1mm) |
|
| Min Space Width (b) |
0.005"(0.127mm) |
0.004"(0.1mm) |
| Min Annular Ring |
0.006"(0.15mm) |
 |
0.004"(0.1mm) |
|
| SMD Pitch (a) |
0.02"(0.5mm) |
 |
0.012"(0.3mm) |
|
| BGA Pitch (b) |
0.03"(0.8mm) |
0.02"(0.5mm) |
| Pattern Plating |
OK |
Solder Mask |
| Min Solder Mask Dam (a) |
0.006"(0.15mm) |
 |
0.004"(0.1mm) |
|
| Soldermask Clearance (b) |
0.006"(0.15mm) |
0.004"(0.1mm) |
| Min SMT Pad spacing (c) |
0.007"(0.18mm) |
0.006"(0.127mm) |
| Solder Mask Thickness |
0.0007"(0.018mm) |
Holes |
| Min Hole Size (a) |
0.008"(0.2mm) |
 |
| Max Hole Size (a) |
0.257"(6.5mm) |
| Hole to Hole Space (b) |
0.01" ~ 0.008"(0.254 ~ 0.2mm) |
| Hole Size Tol (+/-) |
±0.003"(±0.0762mm) |
±0.002"(±0.05mm) |
| Aspect Ratio |
'10 : 1 |
'12 : 1 |
| Hole Registration |
0.002"(0.05mm) |
| Via on PTH |
OK |
| Via in Pad |
OK |
Plating |
| HASL |
0.3u"~0.34u" (7.0 ~ 8.0) |
| Immersion Tin |
0.030u"~0.050u" (0.762 ~ 1.27) |
| Immersion Gold |
0.002u"~0.003u" (0.05 ~ 0.0762) |
| Gold Finger |
0.030u"~0.050u" (0.762 ~ 1.27) |
| Nickel Plating |
0.15u"~0.2u" (3.81 ~ 5.08) |
| Electrolityc Hard Gold |
0.067u" (1.7) |
Outline |
| Tooling Hole to Routed Edge Registration (+/-) |
±0.005" (± 0.127) |
| Panel Outline Tol (+/-) |
0.008" (0.2) |
| Guide Rail |
0.4" (10mm) |
| Beveling |
20, 30', 45' |
Panel |
| Max Size |
27.6" x 23.6" (700mm x 600mm) |
